国际标准分类(ICS)
19 试验
25 机械制造
29 电气工程
37 成像技术
45 铁路工程
61 服装工业
65 农业
67 食品技术
71 化工技术
77 冶金
79 木材技术
85 造纸技术
93 土木工程
95 军事工程
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现行
译：T/CMIF 137-2021 Silver-gold alloy wire for semiconductor packaging bonding适用范围：范围:本文件规定了半导体封装键合用银金合金丝的产品分类、技术要求、试验方法、检验规则、标志、包装、运输和贮存。 本文件适用于半导体封装键合用银金合金丝; 主要技术内容:前言 ···························································································································· III1 范围 ·························································································································· 12 规范性引用文件 ·········································································································· 13 术语和定义 ················································································································· 14 产品分类 ···················································································································· 14.1 产品代号 ··············································································································· 14.2 产品分类 ··············································································································· 15 技术要求 ·····································【国际标准分类号(ICS)】 ：31.190电子元器件组件 【中国标准分类号(CCS)】 ：H60/69有色金属及其合金产品发布单位或类别：(CN-TUANTI)团体标准 | 发布时间： 2021-01-19 | 实施时间： 2021-03-01收藏