GB/T 44514-2024 微机电系统（MEMS）技术 层状MEMS材料界面黏附能四点弯曲试验方法

ICS

31.080.99

CCS

L

59

中华人民共和国国家标准

GB/T44514—2024/IEC62047﹘31:2019

微机电系统（MEMS）技术

层状MEMS材料界面黏附能四点弯曲

试验方法

Micro-electromechanicalsystem(MEMS)technology—Four-pointbendingtest

methodforinterfacialadhesionenergyoflayeredMEMSmaterials

(IEC62047-31:2019,Semiconductordevices—Micro-electromechanical

devices—Part31：Four-pointbendingtestmethodforinterfacialadhesionenergy

oflayeredMEMSmaterials,IDT)

2024-09-29发布2024-09-29实施

国家市场监督管理总局发布

国家标准化管理委员会

GB/T44514—2024/IEC62047﹘31:2019

目次

前言

·····································································································

Ⅲ

1

范围

··································································································

1

2

规范性引用文件

······················································································

1

3

术语、定义、符号和名称

············································································

1

3.1

术语和定义

······················································································

1

3.2

符号和名称

······················································································

1

4

试验件

································································································

2

4.1

总体要求

·························································································

2

4.2

试验件的形状

····················································································

2

4.3

尺寸测量

·························································································

3

4.4

能量释放率的评价

···············································································

3

5

试验方法和试验装置

·················································································

3

5.1

试验原理

·························································································

3

5.2

试验设备

·························································································

3

5.3

试验程序

·························································································

3

5.4

试验环境

·························································································

4

6

试验报告

······························································································

4

附录A（资料性）

四点弯曲试验中的失效模式

·······················································

6

A.1

总则

·····························································································

6

A.2

失效模式

························································································

6

参考文献

··································································································

8

Ⅰ

GB/T44514—2024/IEC62047﹘31:2019

前言

本文件按照GB/T1.1—2020《标准化工作导则第1部分：标准化文件的结构和起草规则》的规

定起草。

本文件等同采用IEC62047﹘31：2019《半导体器件微机电器件第31部分：层状MEMS材料界

面结合能的四点弯曲试验方法》。

本文件做了下列最小限度的编辑性改动：

—为与现有标准协调，将标准名称改为《微机电系统（MEMS）技术层状MEMS材料界面黏附

能四点弯曲试验方法》；

—为显示试验件原始状态，增加了图1a）试验前带有预制裂纹的试验件示意图，同时增加了压辊

和支承辊的说明。

请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。

本文件由全国微机电技术标准化技术委员会（SAC/TC336）提出并归口。

本文件起草单位：北京自动化控制设备研究所、合肥美的电冰箱有限公司、中机生产力促进中心有

限公司、北京晨晶电子有限公司、山东中康国创先进印染技术研究院有限公司、苏州大学、西安交通大

学、中国科学院空天信息创新研究院、深圳市速腾聚创科技有限公司、无锡华润上华科技有限公司、安

徽奥飞声学科技有限公司、航天长征火箭技术有限公司、天津新智感知科技有限公司、华东电子工程研

究所（中国电子科技集团公司第三十八研究所）、山东中科思尔科技有限公司、苏州和林微纳科技股份

有限公司、明石创新（烟台）微纳传感技术研究院有限公司。

本文件主要起草人：王永胜、曹诗亮、尚克军、李根梓、刘韧、汤一、毛志平、孙立宁、王志广、

陈德勇、杨旸、要彦清、张鲁宇、鲁毓岚、张新伟、安志武、郑冬琛、路文一、陈得民、张红旗、

商艳龙、李帆雅、钱晓晨、高峰。

Ⅲ

GB/T44514—2024/IEC62047﹘31:2019

微机电系统（MEMS）技术

层状MEMS材料界面黏附能四点弯曲

试验方法

1范围

本文件描述了基于断裂力学概念的四点弯曲测量方法，利用作用在层状MEMS材料上的纯弯曲力

矩，以最弱界面稳态开裂的临界弯曲力矩来测量界面黏附能。

本文件适用于在半导体基底上沉积薄膜层的MEMS器件。薄膜层总厚度宜小于支撑基底（通常是硅

晶片）厚度的1/100。

2规范性引用文件

本文件没有规范性引用文件。

3术语、定义、符号和名称

3.1术语和定义

下列术语和定义适用于本文件。

3.1.1

能量释放率energyreleaserate

G

在裂纹增长过程中释放的单位表面积的应变能。

注：能量释放率被认为是裂纹驱动力，单位为焦耳每平方米（J/m2）。

3.1.2

界面黏附能interfacialadhesionenergy

Gc

当界面裂纹开始增长并沿界面稳定扩展时的能量释放率。

注：又称为临界能量释放率，其单位为焦耳每平方米（J/m2）。

3.2符号和名称

试验件的形状和符号分别如图1和表1所示。试验件的整体形状类似于三明治式悬臂梁，它应有一

个预制裂纹或一个用于萌生裂纹的缺口。裂纹萌生后，裂纹沿着层状材料体系中最弱的界面延伸。

1