译：GB/T 18910.2-2003 Liquid crystal and solid-state display devices—Part 2:Liquid crystal display modules sectional specification

译：GB/T 19247.3-2003 Printed board assemblies—Part 3:Sectional specification-Requirements for through-hole mount soldered assemblies

译：GB/T 4182-2003 Molybdenum wire

译：GB/T 18794.7-2003 Information technology—Open Systems Interconnection—Security Frameworks for Open systems—Part 7:Security audit and alarms framework

译：GB/T 19247.4-2003 Printed board assemblies—Part 4:Sectional specification-Requirements for terminal soldered assemblies

译：GB/T 2423.52-2003 Environmental testing for electric and electronic products—Part 2:Test methods—Test 77:Body strength and impact shock

译：GB/T 5729-2003 Fixed resistors for use in electronic equipment—Part 1:Generic specification

译：GB/T 19405.1-2003 Surface mounting technology—Part 1:Standard method for the specification of surface mounting components(SMDs)

译：GB/T 19404-2003 Microwave ferrite components—Measuring methods for major properties

译：GB/T 19403.1-2003 Semiconductor devices—Integrated Circuits—Part11:Section1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits)