译：GB/T 5095.12-1997 Electromechanical components for electronic equipment—Basic testing procedures and measuring methods—Part 12:Soldering tests Section 6:Test 12f—Sealing against flux and cleaning solvents in machine soldering

译：GB/T 5095.8-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 8:Connector tests(mechanical) and mechanical tests on contacts and terminations

译：GB/T 5095.3-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods —Part 3:Current-carrying capacity tests

译：GB/T 5095.1-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 1:General

译：GB/T 5095.4-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 4:Dynamic stress tests

译：GB/T 5095.15-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 15:Mechanical tests on contacts and terminations Section 8:Test 15h—Contact retention system resistance to tool application

译：GB/T 5095.7-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 7:Mechanical operating tests and sealing tests

译：GB/T 5095.2-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 2:General examination, electrical continuity and contact resistance tests, insulation tests and voltage stress tests

译：GB/T 5095.6-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 6:Climatic tests and soldering tests

译：GB/T 5095.9-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 9:Miscellaneous tests